CN
A Series: Chip Solder Lug, Multifunctional Placement Equipment
Multi head design using dual drive gantry which allows a wide range of applications
  • Placement Accuracy
    ±0.01mm
  • Wafers size
    8 /12 inch
Device Feature

Mounting products mainly include DBC

wafer (compatible with 8/12 inch)

stacked tray coil,

resistance coil

tin coil (automatic forming) and flexible vibrating disk bulk material

Equipment Feature

Multi head design using dual drive gantry which allows a wide range of applications

Realize automatic wafer feeding, tin sheet cutting and moulding, tin sheet, chip, resistance suction and mounting, automatic quick change of nozzle, automatic quick change of wafer ejector, and automatic calibration of camera

With SECS/GEM communication function, production data/equipment abnormalities are automatically uploaded to MES/EAP

Specification
Footprint 1240mm*1290mm*2000mm(L*W*H)
Weight ≤2000kg
Placement Accuracy ±0.01mm
Wafers size 8 /12 inch
NTC Tape Reel, Electronic feeder
Tin Sheets size 2mm~16mm(L)/0.09mm~0.35mm(W)
Nozzles 10x Quick change nozzles
Power AC220V,50HZ
Pneumatics 0.5~0.7mpa
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